Title: "Sustainable Computing Systems - 3D Stacked Chips and Thermal Awareness"

 

Abstract: 3D stacking of chips offers exciting new possibilities for compact, high-performance semiconductor systems, but also leads to an energy and thermal footprint that needs attention in sustainable computing systems of the future. We will highlight the interdisciplinary nature of the research into such systems and point out how disparate fields of high-level computer system design, semiconductor systems, and thermal simulations, need to collaborate to harmoniously operate the systems that need to obey thermal constraints while delivering high computing performance. Dynamic Thermal Management strategies need to be carefully co-ordinated with voltage/frequency scaling and task mapping decisions to deliver the highest performance in the presence of thermal constraints. We discuss recent research at IIT Delhi targeting these areas, along with the CoMeT simulation platform, a multi-institutional effort enabling the investigation of such scenarios.